People
KIM YUN CHAN
Ph.D. program
Office:
032-850-0136
Email:
kyc20@kitech.re.kr
Research field
Sintering, Soldering and Brazing Technology for bonding of Electric Vehicle Power Module Packaging
KIM SHIN IL
Master’s program
Office:
032-850-0136
Email:
kimsinil6763@kitech.re.kr
Research field
Electric Vehicle Battery Module Packaging Using Laser-Assisted Soldering
PARK SEONG HWAN
Master’s program
Office:
032-850-0136
Email:
tjdghks784@kitech.re.kr
Research field
Laser-Assisted Joining/Welding/Additive Manufacturing Technology
SEO SEONG JI
Ph.D. program
Office:
032-850-0136
Email:
ssg4915@kitech.re.kr
Research field
Optimizing of heat treatment / Welding and Post weld heat treatment
KIM YEH RI
Ph.D. program
Office:
032-850-0136
Email:
yehri1@kitech.re.kr
Research field
Electric Vehicle Power Module Packaging (Sinter Bonding)
KIM SEO AH
Master’s program
Office:
032-850-0136
Email:
seoah234@kitech.re.kr
Research field
Electric Vehicle Power Module Packaging (Sinter bonding)
JO EUN JIN
Master’s program
Office:
032-850-0137
Email:
ejej0206@kitech.re.kr
Research field
Electric Vehicle Power modules/Electronics Packaging (Laser/Reflow Process Technology)
KIM JA HYEON
Ph.D Program
Office:
032-850-0136
Email:
jh6567@kitech.re.kr
Research field
Interfacial Evaluation of Combined Pb-Free Solder Joints and Development of Reliability Improvement Technology
IM TAE YOON
Master’s Program
Office:
032-850-0137
Email:
yoon3000@kitech.re.kr
Research field
Development of Reliability Improvement Technology of Mechanical Properties of Mixed Solder Joints Using Laser-Assisted
CHOI YOUNG RAN
Master’s Program
Office:
032-850-0137
Email:
yr980914@kitech.re.kr
Research field
Evaluation of Mechanical Characteristics and Technological Development for Enhanced Reliability of Fine-Pitch Interconnects
SOHN MIN JEONG
Ph.D. program
Office:
032-850-0137
Email:
alswjd0302@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
NA JEE HOO
Master’s program
Office:
032-850-0137
Email:
gihoo0202@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
LEE MIN HYUCK
Master’s program
Office:
032-850-0137
Email:
qhdlwj89@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
LEE EUN HYE
Master’s program
Office:
032-850-0137
Email:
grace@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
HAN SANG EUN
Master’s program
Office:
032-850-0137
Email:
sangeun35@kitech.re.kr
Research field
Thermal Compression Bonding(TCB) and Laser-Assisted Bonding(LAB) Technology for Flip-Chip Packaging
HAN SEONG HUI
Master’s Program
Office:
032-850-0137
Email:
han6755@kitech.re.kr
Research field
Failure Analysis and Reliability Evaluation of Solder Joints using Laser-Assisted Bonding(LAB)
CHOI DONG GYU
Master’s program
Office:
032-850-0137
Email:
cdg0827@kitech.re.kr
Research field
Development of Heterojunction Materials for Fine Pitch Semiconductor Packaging
JEONG JE YONG
Master’s Program
Office:
032-850-0137
Email:
jjy0419@kitech.re.kr
Research field
Epoxy Resin Adhesive Research and Development / Properties Reliability
