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Research
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Our Research
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Materials for semiconductor packaging and joining process
Solder alloy & solder paste
Adhesive for semiconductor packaging
Epoxy adhesives & Bonding equipment
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Advanced surface mount technology
Surface mount technology
Laser soldering/surface mount
Sinter die attach
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Advanced semiconductor package interconnect technology
Wire bonding
Flip chip bonding
Underfill process
Laser assisted bonding (LAB)
Hybrid bonding
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Advanced joining process technology
Microwave irradiation bonding
Femtosecond laser technology for micro-joining
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Electronic packaging reliability test and analysis
Reliability test
Deformation visualization using digital image correlation
Material property based simulation
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