Researchers

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Researchers
Students
Alumni
고용호 반명함
Yong-Ho Ko
Principal Researcher / HEAD
Office:
032-8500-282

Email:

yonghoko@kitech.re.kr

Research field

Various Interconnection Technologies for 1st/2nd (Chip/Board) Level Semiconductor/Electronic Packaging, Technologies for Evaluating/Analyzing/Improving Reliability of Semiconductor/Electronic Packages
member5
Dongjin Kim
Senior Researcher
Office:
032-8500-159

Email:

dongjinkim@kitech.re.kr

Research field

Bonding structure enhancement and failure mechanism analysis of power modules
member4
Min-Su Kim
Principal Researcher
Office:
032-8500-206

Email:

mskim927@kitech.re.kr

Research field

Power module packaging, reliability Adhesive and adhesion process Materials characterization
member9
KIM JUNKI
Principal Researcher
Office:
032-8500-221

Email:

jkim@kitech.re.kr

Research field

Electric Packaging process & Epoxy formulation, Wearable & loT Electric packaging, Development to smartization of welding and joining process
member7
Jiyong PARK
Principal Researcher
Office:
032-8500-288

Email:

j.park@kitech.re.kr

Research field

Laser-Assisted Joining/Welding/Additive Manufacturing Technology
01 방정환 박사님 사진
Junghwan Bang
Principal Researcher / DIRECTOR
Office:
032-8500-217

Email:

nova75@kitech.re.kr

Research field

Semiconductor packaging, Automotive electronics and Power module, EV battery, Pb-free SMT
member2
Yu Dongyurl
Senior Researcher
Office:
032-8500-224

Email:

alpha0987@kitech.re.kr

Research field

Semiconductor packaging, High Temperature Lead-free Solder bonding technology
02 유세훈 박사님 사진
YOO SEHOON
Principal Researcher
Office:
032-8500-268

Email:

yoos@kitech.re.kr

Research field

Semiconductor packaging Interconnect & Assembly material and bonding process, Evaluation of package joint properties
member1
LEE SO JEONG
Researcher
Office:
032-8500-224

Email:

flthwha27@kitech.re.kr

Research field

Electric Packaging process & Epoxy formulation, High-strength & cryogenic bonding material Technology
member8
Lee Chang-Woo
Principal Researcher
Office:
032-8500-245

Email:

cwlee@kitech.re.kr

Research field

Evaluation of Materials & Processing , Metal 3D Printing, Electric Packaging
member3
Tae-Ik Lee
Principal Researcher
Office:
032-8500-225

Email:

tilee@kitech.re.kr

Research field

Mechanical Reliability of Electronic Packages / Flexible, Novel Bonding Technology

Advanced Packaging Integration Center, APIC

Address
156 Gaetbeol-ro, Yeonsu-gu, Incheon, Republic of Korea (21999)

E-mail

apic@kitech.re.kr

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