People
Yong-Ho Ko
Principal Researcher / HEAD
Office:
032-8500-282
Email:
yonghoko@kitech.re.kr
Research field
Various Interconnection Technologies for 1st/2nd (Chip/Board) Level Semiconductor/Electronic Packaging, Technologies for Evaluating/Analyzing/Improving Reliability of Semiconductor/Electronic Packages
Dongjin Kim
Senior Researcher
Office:
032-8500-159
Email:
dongjinkim@kitech.re.kr
Research field
Bonding structure enhancement and failure mechanism analysis of power modules
Min-Su Kim
Principal Researcher
Office:
032-8500-206
Email:
mskim927@kitech.re.kr
Research field
Power module packaging, reliability Adhesive and adhesion process Materials characterization
KIM JUNKI
Principal Researcher
Office:
032-8500-221
Email:
jkim@kitech.re.kr
Research field
Electric Packaging process & Epoxy formulation, Wearable & loT Electric packaging, Development to smartization of welding and joining process
Jiyong PARK
Principal Researcher
Office:
032-8500-288
Email:
j.park@kitech.re.kr
Research field
Laser-Assisted Joining/Welding/Additive Manufacturing Technology
Junghwan Bang
Principal Researcher / DIRECTOR
Office:
032-8500-217
Email:
nova75@kitech.re.kr
Research field
Semiconductor packaging, Automotive electronics and Power module, EV battery, Pb-free SMT
Yu Dongyurl
Senior Researcher
Office:
032-8500-224
Email:
alpha0987@kitech.re.kr
Research field
Semiconductor packaging, High Temperature Lead-free Solder bonding technology
YOO SEHOON
Principal Researcher
Office:
032-8500-268
Email:
yoos@kitech.re.kr
Research field
Semiconductor packaging Interconnect & Assembly material and bonding process, Evaluation of package joint properties
LEE SO JEONG
Researcher
Office:
032-8500-224
Email:
flthwha27@kitech.re.kr
Research field
Electric Packaging process & Epoxy formulation, High-strength & cryogenic bonding material Technology
Lee Chang-Woo
Principal Researcher
Office:
032-8500-245
Email:
cwlee@kitech.re.kr
Research field
Evaluation of Materials & Processing , Metal 3D Printing, Electric Packaging
Tae-Ik Lee
Senior Researcher
Office:
032-8500-225
Email:
tilee@kitech.re.kr
Research field
Mechanical Reliability of Electronic Packages / Flexible, Novel Bonding Technology
