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Researchers
Students
Alumni
김윤찬
KIM YUN CHAN
Ph.D. program
Office:
032-850-0136

Email:

kyc20@kitech.re.kr

Research field

Sintering, Soldering and Brazing Technology for bonding of Electric Vehicle Power Module Packaging
김신일
KIM SHIN IL
Master’s program
Office:
032-850-0136

Email:

kimsinil6763@kitech.re.kr

Research field

Electric Vehicle Battery Module Packaging Using Laser-Assisted Soldering
박성환
PARK SEONG HWAN
Master’s program
Office:
032-850-0136

Email:

tjdghks784@kitech.re.kr

Research field

Laser-Assisted Joining/Welding/Additive Manufacturing Technology
서성지
SEO SEONG JI
Ph.D. program
Office:
032-850-0136

Email:

ssg4915@kitech.re.kr

Research field

Optimizing of heat treatment / Welding and Post weld heat treatment
김예리
KIM YEH RI
Ph.D. program
Office:
032-850-0136

Email:

yehri1@kitech.re.kr

Research field

Electric Vehicle Power Module Packaging (Sinter Bonding)
김서아
KIM SEO AH
Master’s program
Office:
032-850-0136

Email:

seoah234@kitech.re.kr

Research field

Electric Vehicle Power Module Packaging (Sinter bonding)
조은진
JO EUN JIN
Master’s program
Office:
032-850-0137

Email:

ejej0206@kitech.re.kr

Research field

Electric Vehicle Power modules/Electronics Packaging (Laser/Reflow Process Technology)
김자현
KIM JA HYEON
Ph.D Program
Office:
032-850-0136

Email:

jh6567@kitech.re.kr

Research field

Interfacial Evaluation of Combined Pb-Free Solder Joints and Development of Reliability Improvement Technology
임태윤
IM TAE YOON
Master’s Program
Office:
032-850-0137

Email:

yoon3000@kitech.re.kr

Research field

Development of Reliability Improvement Technology of Mechanical Properties of Mixed Solder Joints Using Laser-Assisted
최영란
CHOI YOUNG RAN
Master’s Program
Office:
032-850-0137

Email:

yr980914@kitech.re.kr

Research field

Evaluation of Mechanical Characteristics and Technological Development for Enhanced Reliability of Fine-Pitch Interconnects
손민정 사진
SOHN MIN JEONG
Ph.D. program
Office:
032-850-0137

Email:

alswjd0302@kitech.re.kr

Research field

Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
나지후 사진
NA JEE HOO
Master’s program
Office:
032-850-0137

Email:

gihoo0202@kitech.re.kr

Research field

Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
이민혁 사진
LEE MIN HYUCK
Master’s program
Office:
032-850-0137

Email:

qhdlwj89@kitech.re.kr

Research field

Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
이은혜 사진
LEE EUN HYE
Master’s program
Office:
032-850-0137

Email:

grace@kitech.re.kr

Research field

Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
한상은
HAN SANG EUN
Master’s program
Office:
032-850-0137

Email:

sangeun35@kitech.re.kr

Research field

Thermal Compression Bonding(TCB) and Laser-Assisted Bonding(LAB) Technology for Flip-Chip Packaging
한성희
HAN SEONG HUI
Master’s Program
Office:
032-850-0137

Email:

han6755@kitech.re.kr

Research field

Failure Analysis and Reliability Evaluation of Solder Joints using Laser-Assisted Bonding(LAB)
최동규
CHOI DONG GYU
Master’s program
Office:
032-850-0137

Email:

cdg0827@kitech.re.kr

Research field

Development of Heterojunction Materials for Fine Pitch Semiconductor Packaging
증명사진
JEONG JE YONG
Master’s Program
Office:
032-850-0137

Email:

jjy0419@kitech.re.kr

Research field

Epoxy Resin Adhesive Research and Development / Properties Reliability

Advanced Packaging Integration Center, APIC

Address
156 Gaetbeol-ro, Yeonsu-gu, Incheon, Republic of Korea (21999)

E-mail

apic@kitech.re.kr

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