People
![Students 1 김윤찬](https://apic.re.kr/wp-content/uploads/2023/11/김윤찬.jpg)
KIM YUN CHAN
Ph.D. program
Office:
032-850-0136
Email:
kyc20@kitech.re.kr
Research field
Sintering, Soldering and Brazing Technology for bonding of Electric Vehicle Power Module Packaging
![Students 2 김신일](https://apic.re.kr/wp-content/uploads/2023/11/김신일.jpg)
KIM SHIN IL
Master’s program
Office:
032-850-0136
Email:
kimsinil6763@kitech.re.kr
Research field
Electric Vehicle Battery Module Packaging Using Laser-Assisted Soldering
![Students 3 박성환](https://apic.re.kr/wp-content/uploads/2023/11/박성환.png)
PARK SEONG HWAN
Master’s program
Office:
032-850-0136
Email:
tjdghks784@kitech.re.kr
Research field
Laser-Assisted Joining/Welding/Additive Manufacturing Technology
![Students 4 서성지](https://apic.re.kr/wp-content/uploads/2023/11/서성지.jpg)
SEO SEONG JI
Ph.D. program
Office:
032-850-0136
Email:
ssg4915@kitech.re.kr
Research field
Optimizing of heat treatment / Welding and Post weld heat treatment
![Students 5 김예리](https://apic.re.kr/wp-content/uploads/2023/11/김예리.jpg)
KIM YEH RI
Ph.D. program
Office:
032-850-0136
Email:
yehri1@kitech.re.kr
Research field
Electric Vehicle Power Module Packaging (Sinter Bonding)
![Students 6 김서아](https://apic.re.kr/wp-content/uploads/2023/11/김서아.jpeg)
KIM SEO AH
Master’s program
Office:
032-850-0136
Email:
seoah234@kitech.re.kr
Research field
Electric Vehicle Power Module Packaging (Sinter bonding)
![Students 7 조은진](https://apic.re.kr/wp-content/uploads/2023/11/조은진.jpg)
JO EUN JIN
Master’s program
Office:
032-850-0137
Email:
ejej0206@kitech.re.kr
Research field
Electric Vehicle Power modules/Electronics Packaging (Laser/Reflow Process Technology)
![Students 8 임태윤](https://apic.re.kr/wp-content/uploads/2023/11/임태윤.png)
IM TAE YOON
Master’s Program
Office:
032-850-0137
Email:
yoon3000@kitech.re.kr
Research field
Development of Reliability Improvement Technology of Mechanical Properties of Mixed Solder Joints Using Laser-Assisted
![Students 9 김자현](https://apic.re.kr/wp-content/uploads/2023/11/김자현.png)
KIM JA HYEON
Ph.D Program
Office:
032-850-0136
Email:
jh6567@kitech.re.kr
Research field
Interfacial Evaluation of Combined Pb-Free Solder Joints and Development of Reliability Improvement Technology
![Students 10 최영란](https://apic.re.kr/wp-content/uploads/2023/11/최영란.png)
CHOI YOUNG RAN
Master’s Program
Office:
032-850-0137
Email:
yr980914@kitech.re.kr
Research field
Evaluation of Mechanical Characteristics and Technological Development for Enhanced Reliability of Fine-Pitch Interconnects
![Students 11 손민정 사진](https://apic.re.kr/wp-content/uploads/2023/11/손민정_사진.jpg)
SOHN MIN JEONG
Ph.D. program
Office:
032-850-0137
Email:
alswjd0302@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
![Students 12 나지후 사진](https://apic.re.kr/wp-content/uploads/2023/11/나지후_사진.jpg)
NA JEE HOO
Master’s program
Office:
032-850-0137
Email:
gihoo0202@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
![Students 13 이민혁 사진](https://apic.re.kr/wp-content/uploads/2023/11/이민혁_사진.jpg)
LEE MIN HYUCK
Master’s program
Office:
032-850-0137
Email:
qhdlwj89@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
![Students 14 이은혜 사진](https://apic.re.kr/wp-content/uploads/2023/11/이은혜_사진.jpg)
LEE EUN HYE
Master’s program
Office:
032-850-0137
Email:
grace@kitech.re.kr
Research field
Mechanical Realiability of Advanced Semiconductor Packages / Digital image Correlation / Flexible and Advanced Bonding Technology
![Students 15 한상은](https://apic.re.kr/wp-content/uploads/2023/11/한상은.jpeg)
HAN SANG EUN
Master’s program
Office:
032-850-0137
Email:
sangeun35@kitech.re.kr
Research field
Thermal Compression Bonding(TCB) and Laser-Assisted Bonding(LAB) Technology for Flip-Chip Packaging
![Students 16 한성희](https://apic.re.kr/wp-content/uploads/2023/11/한성희.jpeg)
HAN SEONG HUI
Master’s Program
Office:
032-850-0137
Email:
han6755@kitech.re.kr
Research field
Failure Analysis and Reliability Evaluation of Solder Joints using Laser-Assisted Bonding(LAB)
![Students 17 최동규](https://apic.re.kr/wp-content/uploads/2023/11/최동규.jpeg)
CHOI DONG GYU
Master’s program
Office:
032-850-0137
Email:
cdg0827@kitech.re.kr
Research field
Development of Heterojunction Materials for Fine Pitch Semiconductor Packaging
![Students 18 증명사진](https://apic.re.kr/wp-content/uploads/2024/02/증명사진.jpg)
JEONG JE YONG
Master’s Program
Office:
032-850-0137
Email:
jjy0419@kitech.re.kr
Research field
Epoxy Resin Adhesive Research and Development / Properties Reliability