People
Yong-Ho Ko
Principal Researcher / HEAD
Office:
032-8500-282
Email:
yonghoko@kitech.re.kr
Research field
Various Interconnection Technologies for 1st/2nd (Chip/Board) Level Semiconductor/Electronic Packaging, Technologies for Evaluating/Analyzing/Improving Reliability of Semiconductor/Electronic Packages
![Researchers 2 member5](https://apic.re.kr/wp-content/uploads/2023/08/member5.png)
Dongjin Kim
Senior Researcher
Office:
032-8500-159
Email:
dongjinkim@kitech.re.kr
Research field
Bonding structure enhancement and failure mechanism analysis of power modules
![Researchers 3 member4](https://apic.re.kr/wp-content/uploads/2023/08/member4.png)
Min-Su Kim
Principal Researcher
Office:
032-8500-206
Email:
mskim927@kitech.re.kr
Research field
Power module packaging, reliability Adhesive and adhesion process Materials characterization
![Researchers 4 member9](https://apic.re.kr/wp-content/uploads/2023/08/member9.png)
KIM JUNKI
Principal Researcher
Office:
032-8500-221
Email:
jkim@kitech.re.kr
Research field
Electric Packaging process & Epoxy formulation, Wearable & loT Electric packaging, Development to smartization of welding and joining process
![Researchers 5 member7](https://apic.re.kr/wp-content/uploads/2023/08/member7.png)
Jiyong PARK
Principal Researcher
Office:
032-8500-288
Email:
j.park@kitech.re.kr
Research field
Laser-Assisted Joining/Welding/Additive Manufacturing Technology
![Researchers 6 01 방정환 박사님 사진](https://apic.re.kr/wp-content/uploads/2023/08/01_방정환-박사님-사진.png)
Junghwan Bang
Principal Researcher / DIRECTOR
Office:
032-8500-217
Email:
nova75@kitech.re.kr
Research field
Semiconductor packaging, Automotive electronics and Power module, EV battery, Pb-free SMT
![Researchers 7 member2](https://apic.re.kr/wp-content/uploads/2023/08/member2.png)
Yu Dongyurl
Senior Researcher
Office:
032-8500-224
Email:
alpha0987@kitech.re.kr
Research field
Semiconductor packaging, High Temperature Lead-free Solder bonding technology
![Researchers 8 02 유세훈 박사님 사진](https://apic.re.kr/wp-content/uploads/2023/08/02_유세훈-박사님-사진.jpg)
YOO SEHOON
Principal Researcher
Office:
032-8500-268
Email:
yoos@kitech.re.kr
Research field
Semiconductor packaging Interconnect & Assembly material and bonding process, Evaluation of package joint properties
![Researchers 9 member1](https://apic.re.kr/wp-content/uploads/2023/08/member1.png)
LEE SO JEONG
Researcher
Office:
032-8500-224
Email:
flthwha27@kitech.re.kr
Research field
Electric Packaging process & Epoxy formulation, High-strength & cryogenic bonding material Technology
![Researchers 10 member8](https://apic.re.kr/wp-content/uploads/2023/08/member8.png)
Lee Chang-Woo
Principal Researcher
Office:
032-8500-245
Email:
cwlee@kitech.re.kr
Research field
Evaluation of Materials & Processing , Metal 3D Printing, Electric Packaging
![Researchers 11 member3](https://apic.re.kr/wp-content/uploads/2023/08/member3.png)
Tae-Ik Lee
Principal Researcher
Office:
032-8500-225
Email:
tilee@kitech.re.kr
Research field
Mechanical Reliability of Electronic Packages / Flexible, Novel Bonding Technology