Reliability refers to the characteristic of a material, component, product, device, or equipment to function without failure and maintain the required functionality and performance under environmental conditions for a time. Reliability test is a technical process that comprehensively assesses requirements, performance, environmental suitability, stability, and analyzes potential failure issues to enable performance improvement of the product. The evaluation period can vary depending on the characteristics of the product, including factors such as frequency of use, distance, cycles, and so on. The specified conditions refer to the conditions that can impact the functionality and performance of the equipment until its disposal. Representative examples of these conditions include temperature, humidity, vibration, shock, and complex environments.

The importance of product reliability analysis is rapidly growing in accordance with the trend of light, thin and compact electronic package components. Failures including cracks, delamination, and warpage easily occur in the recent electronic components even with small deformation and stress, which were not a problem in the past, and precise material properties and deformation analysis are required to reduce them. Digital image correlation is a method of measuring the precise deformation of a material by acquiring optical image series for the deformation of surface of the material, where tracking of the deformation is possible. It is widely used as non-contact strain gauge and can be used in various ways such as 3D shape measurement and component reliability analysis.

Numerical simulation technologies are one of the most promising methods in the electronics industry, along with artificial intelligence (AI) technology, for realizing virtual prototyping. However, in order to obtain realistic and accurate results, it is essential to accurately implement the temperature-dependent material properties and material behavior models that all materials in electronic products undergo. For this purpose, the simulation based on material property databases (DBs) involves experimental contributions to acquire material properties at different temperatures, computational calculations using high-performance workstations, and material-level thermodynamic calculations (e.g., diffusion, solidification, phase diagrams). It aims to enhance manufacturing efficiency by visualizing the operating conditions and failure physics of microelectronic devices.