Tae-Young Lee, Jungsoo Kim, So-Yeon Jun, Byeong-Jin Ahn, Deok-Gon Han, Sehoon Yoo. “Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes” Journal of Materials Science: Materials in Electronics, Volume 34, article number 129, (2023)
