[Seminar Details]
학회 명: The 22nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics (ISMP-IRSP 2024)
[학회 수상]
1) Best paper award (포스터발표 부문)
수상자: 석사과정생 최성규
논문 발표 제목: Microscale failure prediction for thermal fatigue damage in fine pitch solder bump of flip chip package
저자: Seongkyu Choi, Minhyunck Lee, Sang-Eun Han, Jahyeon Kim, Eun-Ho Lee, Tae-Ik Lee
2) Best paper award (포스터발표 부문)
수상자: 석사과정생 정제용
논문 발표 제목: Effect of epoxy composites on thermal and mechanical properties of hybrid Ag paste for pressure-assisted sintering
저자: Je-Yong Jeong, So-Jeong Lee, Jun-Ki Kim, Min-Su Kim
3) Best paper award (포스터발표 부문)
수상자: 석사과정생 한성희
논문 발표 제목: A Comparative Study of Mass Reflow (MR) and Laser Assisted Bonding (LAB) of Sn-Ag-Cu Solder on Ni-less Surface Finishes
저자: Seonghui Han, Sang-Eun Han, Young-Bae Park, Sehoon Yoo