개발자 – APIC

Microwave Bonding of Thin Polymer Substrates Using Carbon Nanotubes for Flexible Interconnections

개발자 — Fri, 26 Jul 2024 11:47:46 +0000

Reduction time effect on the dielectric characteristics of reduced-graphene-oxide–encapsulated barium titanate powder fillers

개발자 — Mon, 18 Mar 2024 04:04:06 +0000

So-Yeon Jun, Seung Hun Park, Min Kyun Sohn, Seungje Kim, Jung Min Lee, Dae Sol Kong, Tae-Young Lee, Jong Hoon Jung, Min-Su Kim, Sehoon Yoo, Jae-Hyeon Ko, SeungNam Cha, Donggeun Jung, Jin-Young Kim, SeGi Yu. “Reduction time effect on the dielectric characteristics of reduced-graphene-oxide–encapsulated barium titanate powder fillers” Carbon, Volume 199, 31 October 2022, Pages 23-32

Interfacial microstructure and brittle fracture behaviorof Sn-based solder on novel nickel-less DEG and EPIGsurface finishes

개발자 — Mon, 18 Mar 2024 04:02:08 +0000

Tae-Young Lee, Jungsoo Kim, So-Yeon Jun, Byeong-Jin Ahn, Deok-Gon Han, Sehoon Yoo. “Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes” Journal of Materials Science: Materials in Electronics, Volume 34, article number 129, (2023)

Thermo‑Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

개발자 — Mon, 18 Mar 2024 03:50:35 +0000

So‑Yeon Jun, Jung‑Hwan Bang, Min‑Su Kim, Deok‑Gon Han, Tae‑Young Lee, Sehoon Yoo. “Thermo‑Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish” Materials 2023, 16, 1739.

Annealing Heat Treatment for Homogenizing the Microstructure and Mechanical Properties of Electron-Beam-Welded Thick Plate of Ti-6Al-4V Alloy

개발자 — Thu, 08 Feb 2024 06:35:43 +0000

https://www.mdpi.com/1996-1944/16/23/7423

정종민

개발자 — Thu, 23 Nov 2023 06:13:44 +0000

염지윤

개발자 — Thu, 23 Nov 2023 06:13:34 +0000

손준혁

개발자 — Thu, 23 Nov 2023 06:13:24 +0000

전소연

개발자 — Thu, 23 Nov 2023 06:13:14 +0000

이태영

개발자 — Thu, 23 Nov 2023 06:13:01 +0000